• T12B-IP1: Common for most models of screen bracket separation/fingerprint repair/CPU chip degumming/face repair
• T12B-IP2: Fingerprint repair/A12/A11/X/XS/XSM motherboard delamination
• T12B-IP3: iPhone 11/11P/11PM/A13 motherboard layering
• T12B-IP4: CPU chip degumming/12/12Mini/12P/12PM motherboard layering
• T12B-IP5: iPhone 13/13Mini/13P/13PM/A15 motherboard layering
• T12B-IP6: iPhone 14/14Plus/14P/14PM/A15/A16 motherboard layering
• T12B-IP7: iPhone X/XR/XS/XSM/12P/12PM/13/13Mini camera
• T12B-IP8: iPhone 11/11P/11PM/13P/13PM camera
• T12B-IP9: iPhone 7G/7P/8G/8P/11/12/12Min/14/14Plus/14P/14PM camera
• T12B-IP10: Android universal
• T12B-lP11: iPhone 15/15Plus/15P/15PM/A16/A17 motherboard layering

Sunshine SS-T12B Universal Intelligent Motherboard Heating Platform for Android & iPhone 7 to 15PM

Features:

SS-T12B Multi-functional universal intelligent maintenance heating Platform, support Android + iPhone series / Upgradable and expandable design / Safe and fast layered fit / No air gun soldering iron

Supports bonding and separation of Android and iPhone 7G to 15Pro Max motherboards, separation of screen frames, etc., and will continue to be updated in the future

Precise temperature control / Smart digital display / Rapid heating / Unlimited expansion

Modular design, a variety of combined modules, common modules on the base, good scalability, easy-to-expand new modules

The heating area is large, the compatibility is good, and it supports the desoldering operation of various motherboard components, which is more convenient and quick

Intelligent temperature control, customized temperature adjustment according to different melting points, with fast heating, long life, and uniform temperature

Supports bonding and separation of Android and iPhone 7G to 15Pro Max motherboards, separation of the screen frame, etc fast and accurate layering, tin planting, glue removal, and bonding of motherboards, etc

360° rotating buckle + guide rail design, suitable for precise clamping of motherboards of different shapes, improving maintenance efficiency

Module quick-release buckle, easy to take out and put in. (Note: before replacing the module after heating, be careful of residual heat burns)

Precise positioning, the module is equipped with a positioning column, which can be accurately separated and attached to the main board, and is easy to take

Heat dissipation and anti-slip design, hollow heat dissipation design, high-temperature resistance Silicone wear-resistant foot pads, stable operation, good anti-skid effect

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